BUY NOW

Phone 13/13Pro/13Pro Max/13 MiniDouble-side UseMiddle Frame Reballing|QLiANLi|QLiANLi Middle Frame

QIANLI 13/13MINI/13PRO/13PROMAX MIDDLE FRAME REBALLING PLATFORM

QIANLI 4IN1 MID FRAME REBALLING PLATFORM FOR IPHONE 13/13MINI/13PRO/13PROMAX

DESCRIPTION:
QIANLI IPHONE MIDDLE FRAME REBALLING PLATFORM FOR IPHONE 13 MOTHERBOARD SOLDERING TOOL, QIANLI IPHONE MIDDLE FRAME REBALLING PLATFORM FOR IPHONE 13 LOGIC BOARD DISSEMBLING AND ASSEMBLING TESTING TOOL.
QIANLI MIDDLE FRAME REBALLING PLATFORM FOR IPHONE13 SEPARATING.

BRAND: QIANLI | TOOLPLUS
COMPATIBILITY
IPHONE MODELS:
* IPHONE 13
* IPHONE 13 MINI
* IPHONE 13 PRO
* IPHONE 13 PRO MAX  Stencils with no bulge under
high temperature
High temperature magnetic strong pressing,
Prevent the stencils from bulging
caused by high temperatur.     Applicable motherboard models
4 in 1 Suitable for Phone Series 12
(4 models) motherboard
1/4 中层植锡网[4IN1】
3/4 中层植锡网 [41N1】
Phone 13
Phone 13 Pro
.4 IINVIO
Phone 13
INVD
(Phone 13 Pro
4/4 中层植锡网【4IN1】
2/4 中层植锡网(4IN1)
Phone 13 Pro Max
Phone 13 Mini
( Phone 13 Pro Max
『 11NMID
Phone 13 Mini

Double-Side Reballing
Double-sided smart design, utilize application space,
improve repair efficiency

Made of imported high
quality steel material
Imported selection of high quality steel material

Manufacture under QianLi black stencils standard
Wear resistance, ultra high toughness
to support reballing

Precise positioning for
the motherboard
CC high-precision integrated processing
Stable positioning for the motherboard
No deviation in reballing

User’s Guide Shows
mo
Install the motherboard: Put the lower layer of
motherboard that needs reballing to the corresponding
positioning pinsPlace it in the synthetic stone base
JANLiCEA®
14 中层植锡网 [4INI】
Install stencils: Align the stencils of the corresponding
model with the positioning pins and put it into the base
ne 13
Apply solder paste: Apply the solder paste at the
corresponding temperature to the reballing hole, make
sure that each hole is covered with solder paste
Heat evenlv: Combine the top cover of the product
with the base and operate Use the hot air gun to heat

Round and plump tin balls
Square chamfer mesh, prevent the tin
balls from being stuck in the mesh

Strong magnetic pressing
prevent the stencils from
bulging and deforming effectively
Press the stencils to prevent deformation
more convenient operation in reballing

Magnet sliding dislocation design
smart application of the sliding dislocation design
easy to take

Double-Side Reballing
Four in One Middle Frame
Reballing Platform
Precise positioning for the motherboard in high
Phone13 13Pro
13Pro Max
13Mini
d
Sliding dislocation
design
LIANIE
中层植锡平台a1N1
13/13Pro/13ProMax/13Mini
* Strong magnetic adsorption
* Precise positioning
* Fast and convenient
* Selected material

Product Size
60*100*18.4mm
Packing Size
62*102*20.4mm
Features
Motherboard reballing, repair
Size Unit
millimeter (mm)
Material
synthetic stone, steel
Product Weight
158.6g
Model
Phone 13 / 13 Pro / 13 Pro Max / 13 Mini